PL-LGA4189-4UN CPU Cooler for 4U Chassis

The ProLab Design PL-LGA4189-4UN is a high-performance 4U Server CPU Cooler engineered specifically for Intel LGA4189 rectangular motherboard platforms, making it ideal for enterprise servers, AI compute systems, virtualization infrastructure, cloud deployments, and high-performance workstation environments. Designed for modern Intel Xeon Scalable processors, the cooler delivers reliable thermal performance for sustained heavy workloads in enterprise and data center applications. Built using a copper base, aluminum fin heatsink assembly, and 6 high-efficiency heat pipes, the PL-LGA4189-4U is optimized for rapid heat transfer and efficient thermal dissipation across high-core-count server CPUs. Supporting processors up to 350W power consumption, the cooler is designed to maintain stable operating temperatures for demanding enterprise computing workloads and mission-critical server deployments. The industrial-grade PWM cooling fan operates between 1300 and 3800 RPM, delivering up to 42.64 CFM airflow for focused cooling performance across dense heatsink fin arrays. Equipped with durable double ball bearings and a 4-pin PWM connector, the fan dynamically adjusts airflow based on processor thermal demand while ensuring long-term reliability in continuous 24/7 operating environments. The cooling solution is engineered to provide efficient airflow optimization while maintaining comparatively controlled acoustic levels of 36.74 dBA maximum. With dimensions of 116.7mm x 92.5mm x 125.5mm, the PL-LGA4189-4U is purpose-built for compatibility with 4U and above rackmount server chassis. The reinforced mounting structure ensures secure installation and optimal contact pressure distribution across Intel LGA4189 processors for stable and reliable long-term operation. Combining enterprise-grade thermal engineering, optimized airflow performance, and support for Intel Xeon server platforms, the ProLab Design PL-LGA4189-4U is an ideal cooling solution for AI servers, virtualization hosts, rendering systems, high-density compute environments, cloud infrastructure, and enterprise-class server deployments requiring dependable high-performance cooling.