Chotest Flash Measuring Machine VX8300 Accuracy: ±3um, Image Senor: 20M CMOS, Measuring Range(XY) 120×110mm

Optional Extras 3006238 OMRON Optical probe for height measurement Standard: Beam φ100μm (S703) Price €6,950 1036040 CAD Importing software module €2,250 PDF of VX8300 please click Item No.: VX8300 Product name: Flash Measuring Machine Image Senor: 20MP CMOS Field of view： 300*200mm(Wide Field) / 230*130mm(High Precision) Resolution: 0.1μm Loading Capacity: 7.5kg Size(LxWxH): 531×503×731mm Weight: 75kg Based on visual measurement principle with precision image analysis algorithms, equipped with double telecentric optical lens with high depth of field, VX8000 series of Flash Measuring Machines achieve fast dimensional measurement by one-key operation. VX8000 series are suitable for precise dimensional measurement in the fields of machinery, electronics, molds, injection molding, hardware, rubber, low-voltage electrical appliances, magnetic materials, precision stamping, connectors, connectors, terminals, mobile phones, home appliances, printed circuit boards, medical equipment, watches, cutting tools, etc. Parameters Model VX8300 Image Senor 20MP CMOS Monitor Built-in 10.4" LCD (XGA:1024×768) Outside 24" LCD (XGA:1920×1080)(Optional) Acceptance Lens Double Tlecentric Lens Light Ring Light Four-segment illumination(White Light) Back Light Telecentric transmission illumination(Green Light) Coaxial Light(optional) LED parallel light F.O.V. Wide Field 300*200mm High Precision 230*130mm Resolution 0.1um Repeatability of Image Meas. Wide Field Without Stitching*1 ±1um With Stitching*2 ±2um High Precision Without Stitching*1 ±0.5um With Stitching*2 ±1.5um Accuracy of Image Meas. Wide Field Without Stitching*1 ±3um With Stitching*2 ±(5+0.02L)μm High Precision Without Stitching*1 ±1.5um With Stitching*2 ±(3+0.02L)μm Horizontal Rotary Unit (Optional) Rotation Angle Range 360°, Resolution 0.02° Rotation Speed 0.2~2rev/s Max Diameter Φ60mm Height Meas. (Optical probe) (Optional) Measuring Range(XY) 120×110mm Max Hole-Depth Ratio(h/φ) 1.64 Dia. of Beam Φ100μm(Φ18μm optional) Resolution 0.25μm Z Non-movement Range(Z) ±2mm Accuracy ±2μm Z Movement Range(Z) 75mm Accuracy ±(6+0.01H)μm, H is Z moving height in mm XY Object Table X Travel range 210mm Y Travel range 110mm Loading Capacity 7.5kg Z-Axis Travel range 75mm Size(LxWxH) 531×503×731mm Weight 75kg Input AC100~240V, 50/60Hz,2A,300W Working Environment Temp.10℃~35℃, Humidity 20%～80%, Vibration<0.002g, Less than 15Hz Remark: *1 In the focus position, the environment temperature is +20 °C ± 1.0 °C *2 In the focus position, the environment temperature is +20 °C ± 1.0 °C, and the load on the table is 2 kg or less; L is the moving range of the table (mm) Applications VisionX software provides up to 80 extraction analysis tools, including [Feature Extraction] (such as maximum points, centerlines, arcs, peaks, etc.), [Accessory Tools] (such as any dot & line & circle, fitted straight line, Fit circle, tangent, inscribed circle, etc.), [Smart Labeling], [shape tolerance] , special [Application Tool] (such as pitch distance, pitch angle, slot, thread, round cross, down Angle, rounded corners, etc.) The measurement results and their main statistical values (such as average, σ, 3σ, 6σ, Ca, Cp, Cpk, etc.) will be automatically recorded and archived. Operators can select different filter conditions for history extraction. Stratistics The trend graph displays the regular trend of the measured values, such as the monotonic and periodic change of the measured values, which can be used for monitoring the abnormality of the production process of producing equipment. Reflecting the status and distribution of fluctuations in product quality, the histogram can intuitively expose information about the quality situation in producing process, which can be used to predict product quality and failure rate. Through quality diagnosis and analysis with statistical methods, SPC can monitor the product quality and changing trend of the producing process. With SPC we can find the preventive solution in the producing process, so that the subsequent inspection and repair are reduced. Consequently, the producing process control and product quality improvement are achieved. More Applications