Низкоплотный пенокомпаунд СТЭП-К510 (Плотность 0,3 г/см³)
Step-K510是一种三组分室温固化的泡沫密封剂,密度低,适用于电子设备的灌封以提高防护性能,也可用于减轻水上和航空器等物品的重量。
- The description claims that it has low density (less than 0.85 g/cm³).
- The description claims enhanced resistance to vibration and temperature changes.
- The description claims it does not become brittle.
- The description claims it cures at room temperature.
- The description claims high adhesion to electronic materials including metals, ceramics, and polymers.
- The description claims a wide operating temperature range from -40°C to +100°C.
Specifications
- Плотность, г/см³
- 0,30 ± 0,05
- Интервал рабочих температур
- -30 ... +120°С (до 150°С кратковременно)
- Время "жизни"
- 10 мин при 23°C (время до начала вспенивания)
AI Readiness
Good foundation, but some important product data is still missing.
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