MPM Edison II Act Automatic stencil printer

MPM Edison II ACT Stencil Printer – Advanced SMT Printing Solution for High-Precision PCB Assembly The MPM Edison II ACT Stencil Printer from ITW EAE is a next-generation SMT stencil printing system engineered to deliver exceptional print accuracy, automation, and production efficiency for modern electronics manufacturing environments. Designed for ultra-fine pitch applications and high-density PCB assembly, the Edison II ACT helps manufacturers improve throughput, reduce operator intervention, and achieve consistently high yields. High-Performance SMT Stencil Printing Technology Built on the proven MPM Edison platform, the Edison II ACT combines industry-leading print precision with intelligent automation capabilities. The system features automated changeover technology (ACT), enabling rapid and error-free transitions between production runs while minimizing downtime and labor requirements. The printer delivers built-in ±8 micron machine alignment and ±15 micron wet print repeatability, making it ideal for demanding semiconductor, automotive, medical, and smart device manufacturing applications. Its advanced print process capability exceeds 2 Cpk for 0201 metric components, supporting the increasing trend toward PCB miniaturization and tighter component densities. Automated Changeover for Increased Manufacturing Efficiency One of the key advantages of the Edison II ACT is its patented Automated Changeover Technology. The system automates stencil, squeegee, tooling, and solder paste cartridge changes, significantly reducing manual intervention and setup errors. Operators can complete changeovers quickly without opening the machine hood, improving production uptime and operational efficiency. Additional automation features include: Automated stencil and tooling exchange Intelligent solder paste cartridge management Barcode verification for process accuracy MES integration for Industry 4.0 manufacturing environments Reduced operator dependency and training requirements These capabilities help manufacturers streamline SMT production while reducing scrap, defects, and process variability. Exceptional Print Quality and Process Control The MPM Edison II ACT is engineered for superior solder paste deposition performance. Its advanced closed-loop pressure control system maintains precise and consistent squeegee force throughout the entire print stroke, helping improve paste transfer efficiency and print consistency across the PCB surface. The machine also incorporates innovative board clamping and coplanarity technologies that optimize stencil-to-board gasketing for improved edge-to-edge print quality and enhanced yields during ultra-thin stencil printing processes. Key Features of the MPM Edison II ACT High-precision SMT stencil printing platform Automated changeover technology for faster setup ±8 micron alignment accuracy ±15 micron wet print repeatability Optimized for 0201 metric and ultra-fine pitch applications Advanced closed-loop squeegee pressure control MES and Industry 4.0 ready connectivity High-speed parallel processing system Reduced cycle times and increased throughput Ideal for semiconductor, automotive, and high-reliability electronics manufacturing Optimized for Modern Electronics Manufacturing The Edison II ACT stencil printer is designed to support manufacturers seeking higher productivity, greater automation, and improved print quality in demanding SMT assembly environments. Its scalable automation platform and advanced process control capabilities make it a strong solution for smart factories and high-volume PCB production lines. We are the proud distributors for MPM printers and Camalot dispensers – please contact us for further information or to arrange your demonstration visit today!