晶圓級 2.5D 先進封裝Die Shift量測機

晶圓級 2.5D 先進封裝Die Shift量測機

0.00 TWD In stock Buy at Merchant

This machine measures die locations for wafer-level 2.5D advanced packaging, specifically for face-up chip stacking processes, including overlay between Contact Vias and pads.

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Takes ~2 minutes. No storefront changes.