FOPLP RDL 細微線路缺陷檢查機

FOPLP RDL 細微線路缺陷檢查機

0.00 TWD In stock Buy at Merchant

This product is designed for fan-out panel-level packaging RDL first process and supports single-layer/multi-layer RDL line layer processes. It features multiple light sources including bright field, dark field, and UV fluorescence.

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Takes ~2 minutes. No storefront changes.