iBt-UV16KT 16K UV TDI Line Scan Camera for Wafer Inspection

Product Description The iBt-UV16KT is a high-resolution 16K UV TDI line scan camera designed for advanced wafer inspection and semiconductor imaging. Featuring 16384 × 256 resolution, 256-TDI architecture, and 5 μm pixels, it provides fine spatial resolution and enhanced sensitivity for detecting subtle defects and surface variations. With a 280 kHz line rate and CXP12 interface, the camera supports high-speed image acquisition for demanding semiconductor inspection systems. Its high-resolution TDI architecture makes it particularly suitable for wafer defect detection, semiconductor inspection, UV fluorescence analysis, and precision surface inspection. Key Features 16K resolution with 16384 active pixels. 256-TDI architecture for enhanced imaging sensitivity. 5 μm pixel size for fine wafer surface details. 280 kHz line rate for high-speed inspection. CXP12 interface for high-bandwidth image transmission. M95 mount for large-format optical integration. Wafer & Semiconductor Inspection The iBt-UV16KT is designed for high-resolution wafer inspection, where small surface defects, contamination, particles, scratches, and pattern variations need to be detected across large wafer areas. The combination of 16K resolution and 256-TDI provides high spatial detail and improved signal accumulation, making it suitable for demanding semiconductor inspection systems. Typical Applications Wafer Defect Detection Semiconductor Wafer Inspection UV Wafer Inspection Surface Defect Inspection Particle & Contamination Detection Semiconductor Pattern Inspection Photolithography Inspection Advanced Scientific Imaging Specifications Model iBt-UV16KT Resolution 16384×256 TDI 256-TDI Line Frequency 280kHz Pixel Size 5μm Interface CXP12 Lens Mount M72