AMTECH 4300/LF-4300 TF

DOWNLOADS Technical Data Sheet Safety Data Sheet PRODUCT INFO Product Highlights REL0 flux classification Optimized for Lead-free and standard alloy systems Wide process window Residue can be left on the board in most assemblies (not recommended for high impedance assemblies) Excellent wetting compatibility on most board finishes Low voiding, Including LGA REACH compliant Application 4300/LF-4300-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. 4300/LF-4300-TF may be used for BGA sphere attachment and reballing. 4300/LF-4300-TF is also designed to work on all flip chip bumping and chip scale packaging sites. Compatible Alloys Alloy Temp °C Temp °F 63Sn/37Pb 183 361 62Sn/36Pb/2Ag 179 354 62.8Sn/36.8Pb/0.4Ag 179-183 354-361 42Sn/58Bi 138 280 42Sn/57Bi/1Ag 138 280 96.5Sn/3.0Ag/0.5Cu 217-220 423-428 99.0Sn/0.3Ag/0.7Cu 217-221 423-430 96.5Sn/3.5Ag 221 430 99.3Sn/0.7Cu 227 441 95Sn/%sB 235-240 455-464 95Sn/5Ag 221-245 430-473 Test Results Test J-STD-004 or other requirements (as stated) Test Requirement Result Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5% Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (no-clean) Surface Insulation Resistance 85 °C, 85% RH @ 168 Hours IPC-TM-650: 2.6.3.7 L: 100 M (no-clean) Viscosity - Malcom @ 10 RPM/25 °C IPC-TM-650: 2.4.34.4 20-48 Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Coalition (EICC) Compliant REACH Compliance Articles 33 and 67 of Regulation (EC) No 1907/2006 Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials Cleaning 4300/LF-4300-TF is a water washable tacky flux that can be left on the board for many SMT assemblies. For applications requiring cleaning, 4300/LF-4300-TF can be cleaned using di-ionized water at 40-60 o C with a recommended water pressure of 30-50 PSI. 4300/LF-4300-TF can also be cleaned using commercially available flux residue removers such INVENTEC Promoclean™ and Promosolv™ cleaning chemistries Storage and Handling Tacky flux should be stored at room temperature (20-25 °C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12-month shelf life. Recommended Profile This profile is designed to serve as a starting point for process optimization using 4300/LF-4300-TF. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds. TAGS