Horus A系列 – 晶圓級3D IC超高精度Die shift量測機
This machine measures and provides feedback on the precision of die placement during 3D IC packaging processes.
AI Readiness
Good foundation, but some important product data is still missing.
62%
This machine measures and provides feedback on the precision of die placement during 3D IC packaging processes.
Good foundation, but some important product data is still missing.