GE Multilin T60U03HKHF8LH6EM8LP6CU8NW Digital Output Module
The GE Multilin T60U03HKHF8LH6EM8LP6CU8NW, also cataloged as the T60 Digital Output Module, operates as a dedicated hardware component for high-speed contact switching and discrete load control within GE Multilin Universal Relay (UR) platforms. Hardware Specifications Parameter Specification Model T60U03HKHF8LH6EM8LP6CU8NW Brand GE Multilin Origin Canada / USA Weight 3.44 kg (7.58 lbs) Dimensions 7 cm x 13.2 cm x 13.7 cm Operating Temp -40 to +70 deg C Power Consumption Backplane powered via internal system bus Product Type Digital Output Module Primary Application Industrial control, breaker tripping, and automation systems Chassis Compatibility Multilin Universal Relay (UR) Series 8U / 4U modular racks Backplane Bus & Deterministic Logic Execution The module interfaces directly with the Universal Relay internal backplane through the system backplane bus communication velocity architecture, receiving high-speed control commands from the primary CPU processor. Internal channel circuitry maintains galvanic isolation between sensitive backplane logic levels and external field control loops. High I/O density scaling allows reliable trip and control signal routing across high-voltage substation switchgear, while maintaining full firmware flash compatibility across standard UR series chassis assemblies. Frequently Asked Questions Q: What precautions should be taken when replacing or seating the T60U03HKHF8LH6EM8LP6CU8NW module in a UR chassis? A: Auxiliary control power to the rack should be isolated prior to removing or inserting the module. Live insertion without taking proper maintenance precautions can disrupt the backplane communication bus or trigger unintended trip output transitions. Q: How is galvanic isolation maintained between internal digital logic and field contact circuits? A: The digital output circuitry incorporates opto-isolators and isolated driver stages that decouple the internal CPU backplane bus from external field DC battery voltages and inductive switching transients. Field Installation Guidelines Module Insertion: Slide the module card smoothly into the designated slot guides on the Universal Relay chassis until the card edge connector seats firmly into the backplane. Secure the top and bottom retaining thumbscrews. Cabinet Grounding: Verify that the host relay chassis is connected to the station ground grid using a short, low-impedance copper ground strap (minimum 10 AWG). Field Wiring Separation: Route high-voltage DC control wiring and contact output lines away from low-voltage communication buses and sensitive analog transducer leads. Terminal Screws: Torque all field terminal wiring screws to 0.5 Nm (4.4 in-lbs) to ensure vibration-proof, low-resistance electrical connections under continuous operation.