Horus A系列 – 面板級2.5D先進封裝高精度Die shift量測機

Horus A系列 – 面板級2.5D先進封裝高精度Die shift量測機

0.00 TWD In stock Buy at Merchant

This machine measures die location for panel-level 2.5D advanced packaging, including chip alignment accuracy and mold process after alignment.

  • The description claims the machine measures chip alignment precision.

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Takes ~2 minutes. No storefront changes.