Teledyne FLIR Hadron™ 640+ -- IN STOCK NOW

The NDAA compliant and ITAR free Hadron™ 640 series pairs a 64MP visible camera with a performance-leading 640x512 resolution radiometric Boson® or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications utilizing Teledyne FLIR Prism™ software. Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA®, Qualcomm®, and more plus industry-leading integration support, Hadron 640 also reduces development cost and shortens time to market. Industry-Leading Thermal and Visible Camera Performance Collect high-speed, VGA radiometric thermal and HD visible imagery. Built for Integrators Reduce development cost and time to market with solution from a single, reliable supplier. Size, Weight, and Power (SWaP) Optimized Design Optimize design and operation time with compact, lightweight, and low-power module. Specifications Thermal Imaging Detector Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Non-Radiometric Imaging & Optical EO Camera Optics Kontatsu B0623D01-0, EFL 4.8mm, 67° HFOV, F/# 1/2.3 EO Camera Sensor 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI EO Camera Video Full resolution @ 60 Hz IMU ICM20602, I2C or SPI (selectable) IR Camera Optics EFL 13.6mm, 32° HFOV, F/# 1.0 IR Camera Video Full resolution @ 60Hz Sensitivity [NEdT] <20 mK Thermal Imaging Detector Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Non-Radiometric Connections & Communications Software Drivers for NVIDIA Jetson Nano for Qualcomm Snapdragon rb5 for Qualcomm Snapdrago 865 *Contact Teledyne FLIR for latest software drivers Electrical Electrical Interface Hadron connector: Hirose DF40C-50DP-0.4V(51) Example of mating connector: DF40HC(2.5)-50DS-0.4V(51) Power Consumption 5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW Mechanical Mechanical Interface Screw mount to back plate Size (L x W x H) 35 x 49 x 45 mm Weight 56g Environmental & Approvals Compliance and Certifications NDAA compliant Environmental Sealing IP54 (with the rear interfaces sealed) Operational & Storage Temperature -20°C to +60°C Tested EMI Performance FCC part 15 Class B Resources FAQ - Everything You Need to Know About the Hadron 640R Important Notes This camera is only available in 60Hz Export Information ECCN 60Hz: 6A003.b.4.b HTSUS: 9027.50.4020 Country of Origin: USA 🕑Lead Time Visit Our Lead Time Page Here