West-Bond 7730E High Frequency Manual Gold Ball Wire Bonder

West-Bond 7730E High Frequency Manual Gold Ball Wire Bonder WESTBOND 7730E-79 is a high-performance precision high frequency fine-pitch wire bonder that provides superior bonding of wires. Thermosonic ball-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices. The machine bonds gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the ball-to-wedge technique using ultrasonic energy and work piece heat. Wire is clamped and threaded vertically through a hollow capillary, allowing independent feeding action. Features the West·Bond three-axis micromanipulator in which the entire mechanism is arrayed above the work plane, so that there is no limit to the size of a work piece. Each of the X, Y, and Z axes is straight-line and purely orthogonal, and each can be braked pneumatically on signal. In this application, all axes are braked during the ultrasonic bond time to aid operator control. 115V, 50/60Hz, 2A