THERM-A-GAP CIP 35 Thermally Conductive Cure-In-Place Compound

THERM-A-GAP CIP 35 Thermally Conductive Cure-In-Place Compound

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JIT Asia THERM-A-GAP® CIP 35 is a two-component dispensable thermal compound with high thermal conductivity, suitable for efficient heat dissipation in electronic components.

  • The description claims outstanding thermal conductivity of 3.5 W/m-K.

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