Sputtering Targets
Angstrom Sciences produces sputtering targets using various processing techniques to create high-density materials for vacuum systems. Materials include precious metals, alloys, and ceramics with purities ranging from 99.5% to 99.9999%.
- The description claims that the materials are produced using specialized processing techniques.
Specifications
- Material
- Al2O3 2x125 Assembly, Aluminium, Aluminium Oxide(Al2O3), Carbon (Graphite), Chromium (Cr), Cobalt (Co), Copper (Cu), Gold (Au), Indium (In), Iron (Fe), ITO (In2O3-SnO2-90/10 wt%) 99.99%, Molybdenum (Mo), Nickel (Ni), Nickel-Chromium(80/20 wt%), Nickel-Vanadium (93/7 wt%), Niobium (Nb), Palladium (Pd), Platinum (Pt), Silicon (Boron Doped), Silicon 2x125 Assembly, Silicon 3x125 Assembly, Silicon 4x125 Assembly, Silicon Dioxide (SiO2), Silver (Ag), Tantalum (Ta), Tin (Sn), Titanium(Ti), Tungsten (W), Zinc (Zn), Zirconium (Zr)
- Purity
- 99.2%, 99.6%, 99.95%, 99.99%, 99.995%, 99.999%
- Size
- 1" Diameter x .060" thick, 1" Diameter x .062" thick, 1" Diameter x .125" thick, 2" Diameter x .010" thick, 2" Diameter x .020" thick, 2" Diameter x .040" thick, 2" Diameter x .060" thick, 2" Diameter x .125" thick, 2" Diameter x .250" thick, 3" Diameter x .010'' thick, 3" Diameter x .020" thick, 3" Diameter x .040" thick, 3" Diameter x .060" thick, 3" Diameter x .125" thick, 3" Diameter x .250" thick, 4'' Diameter x .125" thick, 4" Diameter x .010" thick, 4" Diameter x .020" thick, 4" Diameter x .040" thick, 4" Diameter x .060" thick, 4" Diameter x .250" thick, 6" Diameter x .125" thick, 6" Diameter x .250" thick, 8" Diameter x .125" thick, 8" Diameter x .250" thick, Bonded Target Assembly 2", Bonded Target Assembly 3", Bonded Target Assembly 4"