Modular Process Technology RTP-600XP Rapid Thermal Processing System

Modular Process Technology RTP-600XP Rapid Thermal Processing System The integrated process control system features real time graphics, recipe management, data acquisition and has a comprehensive diagnostic function. Wafer size up to 6”. Temperature Range: 100°C to 800°C with max steady-state typically around 800°C. Extended range pyrometer can be added to increase the maximum temperature. Rapid heating and cooling capabilities from 0°C up to 150°C per second using tungsten-halogen lamps. Quartz chamber. Two MFC Gas inputs. Highly uniform loop array with accurate control and monitoring. 208V, 3 Ph, 60 Hz, 100A.