THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads

THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads

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JIT Asia’s THERM-A-GAP PAD 30 is a thermally conductive gap filler designed to improve heat dissipation between heat sinks and electronic components.

  • The description claims to enhance performance in telecommunications equipment, automotive electronics, and desktop computers.

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