AHSM7394S

AHSM7394S is world's leading WiFi HaLow™ stamp type solder down module The AHSM7394S allows building long range, ultra-low power WiFi networks in sub 1 GHz license-exempt bands, utilizing compact form factor. The AHSM7394S data rate up to 15 Mbps which better than LoRa 38.4 Kbps with the high-speed data rate, it enables connectivity for many IoT applications, including sensors, weather stations, industrial monitoring, medical patient monitoring, agriculture monitoring, surveillance camera. Key Features NEWRACOM NRC7394 HaLow chipset Up to 15Mbps data rate HaLow IPEX/U.FL antenna connector SPI and UART support for host interface Stamp type soldering hole Specifications Hardware Genera Chipset NEWRACOM NRC7394 Frequency 915 MHz (US) 868 MHz (EU) 924 MHz (JP) Modulation OFDM with BPSK, QPSK, 16QAM, 64QAM Date rate Up to 15 Mbps (Max. Phy rate) Channel bandwidth 1/2/4 MHz (US) 1 MHz (EU) 1/2/4 MHz (JP) Antenna connector HaLow IPEX/U.FL antenna connector Host interface SPI, UART Form facto Stamp type solder down module Dimensions 21.8(L) × 19.3(W) x 2.8(H) mm (Includes shielding case) Operating temperature -40°C to +85°C (-40°F to 185°F) Software & SDK https://github.com/newracom Order Information AHSM7394S-915 (US) 902 MHz – 928 MHz 26 MHz AHSM7394S-868 (EU) 863 MHz – 868 MHz 5 MHz AHSM7394S-924 (JP) 920.5 – 927.5 MHz 7 MHz Pciifin Dcaetifioninstion - Pin Map Pin Definition - Pin Description Pin No. Definition Description Voltage Type 1 TXD1 UART1_TXD (UART channel1 Tx data) O 2 RXD1 UART1_RXD (UART channel1 Rx data ) I 3 CTS1 UART1_CTS (UART channel1 clear to send) I 4 RTS1 UART1_RTS (UART channel1 request to send ) O 5 MODE Boot mode (0: ROM boot, 1: XIP boot) I 6 GND GROUND GND 7 GND GROUND GND 8 GND GROUND GND 9 ADC0 Auxiliary ADC channel 0 I 10 ADC1 Auxiliary ADC channel 1 I 11 GP24 General purpose I/O I/O 12 GP25 General purpose I/O I/O 13 GND GROUND GND 14 VDDIO VDD_IO (NRC7394 I/O power input) 1.8V-3.3V Power 15 GND GROUND GND 16 GND GROUND GND 17 VBAT (V33) VBAT (NRC7394 PMS, RF/PA power input) 3.3V Power 18 GND GROUND GND 19 POR_B NRC7394 reset input (active low) POR reset output (internal pull-up) I/O 20 CS_B Host SPI – chip select (active low) I 21 MISO Host SPI – master in slave out O 22 MOSI Host SPI – master out slave in I 23 SCLK Host SPI – clock I 24 EIRQ Host SPI – interrupt (active high) O 25 TXD0 UART0_TXD (UART channel0 Tx data) O 26 RXD0 UART0_RXD (UART channel0 Rx data ) I 27 GP10 General purpose I/O I/O 28 GP11 General purpose I/O I/O G1, G2, G3, G4, G5 GROUND GND Operation Conduction & Current Consumption ◎ Operating condition Symbol Min Typ Max Unit Operating temperature range -40 - +85 °C Operating voltage VBAT 2.7 3.3 3.6 V VDDIO 1.68 3.3 3.6 V Operating current (peak) Tx @16dBm VBAT 250 mA VDDIO 2 mA ◎ Current consumption (Average) MODE DUT Status VDDIO (mA) VBAT(V33) (mA) 802.11ah (1/2/4MHz BW) Tx @ 0 dBm 0.5 105.2 Tx @ 10 dBm 0.5 169.2 Tx @ 15 dBm 0.5 184.4 Continuous Rx @ -85 dBm 0.4 21 Deep sleep mode 0.08uA 3.2uA √ Note: Unless otherwise specified, TA.=25℃, VBAT= 3.3V, 99% tx burst time, MCS0 √ Deep sleep : all clocks are gated, 32M & 32K Xtals off, all power off(except ALON), retention memory off. √ HSPI pins to host are disconnected. √ All GPIOs except for UART0 are connected to GND during VDDIO measurement. ◎ Thermal characteristics (NRC7394 IC Package) Symbol Description Performance Typ Unit TJ Maximum junction temperature 125 °C ΘJA Thermal-resistance junction to ambient 30.53 °C/W ΘJC Thermal-resistance junction to case 3.8 °C/W RF Specifications AHSM7394S Tx transmit power / Rx receive sensitivity Data Rate Modulation BW=1M BW=2M BW=4M BW=8M Tx (dBm) +/-2 Rx (dBm) IEEE spec. Tx (dBm) +/-2 Rx (dBm) IEEE spec. Tx (dBm) +/-2 Rx (dBm) IEEE spec. Tx (dBm) +/-2 Rx (dBm) IEEE spec. MCS0 BPSK 17 -100 -95 17 -98 -92 17 -95 -89 N/A N/A -86 MCS1 QPSK 17 -99 -92 17 -95 -89 17 N/A -86 N/A N/A -83 MCS2 QPSK 17 -97 -90 17 -93 -87 17 N/A -84 N/A N/A -81 MCS3 16-QAM 17 -93 -87 17 -89 -84 17 N/A -81 N/A -N/A -78 MCS4 16-QAM 16 -90 -83 16 -86 -80 16 -83 -77 N/A -N/A -74 MCS5 64-QAM 15 -86 -79 15 -82 -76 15 N/A -73 N/A N/A -70 MCS6 64-QAM 14 -84 -78 14 -80 -75 14 N/A -72 N/A N/A -69 MCS7 64-QAM 11 -82 -77 11 -79 -74 12 -76 -71 N/A N/A -68 Mode Pin Setting MODE pin is provided for boot mode selection to offer flexible and configurable boot options as shown in Table M1. In the case of XIP boot, it is necessary to change to XIP boot mode after FW upload, so users need to install a switch that can control the mode pins on the board. MODE pin Description VDD XIP boot mode (Standalone mode) F/W should be downloaded in external flash memory before power-up. The start address for boot is remapped to the start address of flash memory. GND ROM boot mode (Host mode) Boot from internal ROM code and wait for external command via HSPI or UART. The start address for boot is remapped to the start address of ROM memory. FW upload mode Firmware upgrade to external flash memory or upload to internal SRAM via UART0 Table M1: MODE description Reference Design – UART (Standalone mode) HSPI and UART1 are the general interfaces used for external host MCU. The HSPI is a specially designed SPI for high-speed data transfer. UART0 is used for uploading test firmware or monitoring the firmware logs. Reference Design – HSPI (Host mode) HSPI and UART1 are the general interfaces used for external host MCU. The HSPI is a specially designed SPI for high-speed data transfer. UART0 is used for uploading test firmware or monitoring the firmware logs. Mechanical Information Reflow Soldering Profile Handling and Storage The AHSM7394S class of modules are a moisture-sensitive device rated at Moisture Sensitive Level 3 (MSL3) per IPC/JEDEC J-STD-20. After opening the moisture-sealed storage bag, modules that will be subjected to reflow solder or other high-temperature processes mustbe: 1.Mounted to a circuit board within 168 hours at factory conditions. (≤30°Cand<60%RH) OR 2.Continuously stored per IPC/JEDEC J-STD-033 Modules that have been exposed to moisture and environmental conditions exceeding packaging and storage conditions MUST be baked before mounting according to IPC/JEDEC J-STD-033. Failure to meet packaging and storage conditions will result in irreparable damage to modules during solder reflow.