Horus M系列 – 晶圓級2.5D先進封裝Die shift量測機

Horus M系列 – 晶圓級2.5D先進封裝Die shift量測機

0.00 TWD In stock Buy at Merchant

This machine measures and feedbacks die location for advanced wafer-level packaging, specifically for single chip face-up bonding processes.

AI Readiness

Good foundation, but some important product data is still missing.

66%
3 important fields missing Claim to view full AI report
Data sourced from www.favite.com. Last updated: The description was auto-generated by an AI model based on the merchant's description. It may not be accurate or complete.
Claim www.favite.com to see AI Product Health

Takes ~2 minutes. No storefront changes.