Nano Dimension Resin - ATARU™ True HT - Creme - 1 Liter

A GROUNDBREAKING UV-CURABLE MATERIAL FOR DLP PRINTING ATARU™ is engineered for exceptional hightemperature resistance and durability. ATARU™ also delivers excellent surface quality along with incredibly low dielectric loss. This material offers market-leading thermal performance and durability, signal integrity assurance thanks to unique low dielectric loss property, as well as low viscosity to ensure wide compatibility with different DLP printers. Key Benefits: - High thermal performance and durability - High impact strength - Ultra low dielectric loss - Excellent surface quality - Fast processing Ideal Applications: - Injection Molding - Molding under high pressure & temperature (carbon fiber molding) - Tooling & fixtures - Serial production (high speed curing time) - Radio frequency RF (antenna) Mechanical Properties Property Standard Value Tensile Modulus ISO 527-1/-2 5,640 MPa Stain at Break ISO 527-1/-2 1.9 % Stress at Break ISO 527-1/-2 73 % Flexural Modulus ISO 178 5,360 MPa Flexural Strength ISO 178 127 MPa Flexural Strain at Break ISO 178 2.7 % Izod Impact Strength (unnotched) ASTM D4812 : 2006 236 J/m Thermo-mechanical Properties Property Standard Value CTE (0°C to 110°C) IPC-TM-650 2.4 24.5 45.0 µm/(m∙K) CTE (110°C to 200°C) IPC-TM-650 2.4 24.5 72.6 µm/(m∙K) CTE (200°C to 300°C) IPC-TM-650 2.4 24.5 116.3 µm/(m∙K) Td2 IPC-TM-650 351 °C Td5 IPC-TM-650 378 °C Tg IPC-TM-650 >300 °C HDT/B (0.45 MPa) ISO 75-2:2013-08 >300 °C HDT/A (1.8 MPa) ISO 75-2:2013-08 >300 °C HDT/C (8.0 MPa) ISO 75-2:2013-08 133 °C Thermal Properties Property Standard Value Thermal Conductivity (25 °C) - 0.28 W/mK Thermal Conductivity (50 °C) - 0.29 W/mK Thermal Conductivity (100 °C) - 0.31 W/mK Spec. Heat Capacity (23 °C) - 0.97 J/gK Spec. Heat Capacity (200 °C) - 1.5 J/gK