JTX JS-51 Soldering Flux Efficient Soldering Solution The JTX JS-51 Soldering Flux is designed to offer you seamless, high-quality soldering performance for various electronic and mechanical applications. Whether you’re a professional technician or a hobbyist, this flux ensures pristine results with minimal residue. Exceptional Quality and Versatility This soldering flux excels with its superior formulation, allowing for optimal wetting and adhesion properties. Its wide compatibility ensures reliability across diverse soldering projects, from circuit boards to intricate repairs. Easy Application and Trusted Results Thanks to its user-friendly application and consistent performance, the JTX JS-51 Soldering Flux is your go-to for achieving clean, durable connections. Experience efficiency and dependability in every soldering session. JTX JS-51 Soldering Flux JTX JS-51 Soldering Flux: Complete Technical & Detailed Specification Table Specification Category Parameter / Feature Detailed Technical Description & Practical Insights 1. Product Identity & Overview Brand & Model JTX JS-51 (Manufactured by JiTongXue / JITONGXUE) JTX JS-51 Soldering Flux Product Classification High-performance electronics maintenance soldering flux / SMT repair oil. JTX JS-51 Soldering Flux Primary Application Domain Advanced micro-electronics, mobile phone motherboards, CPU/IC reballing, and precision circuit board (PCB) rework. 2. Packaging & Form Factor Delivery Mechanism Syringe-style container designed for precision application without spillage or material waste. Dispensing Accuracy Compatible with fine-pitch metal or plastic needles for microscopic trace and pad work. Net Weight / Content Standard precision repair volume (approx. 0.022g / custom syringe sizing). 3. Physical & Optical Properties Physical State Semi-viscous, smooth, jelly-like gel matrix that stays precisely where applied without running. Color & Transparency Transparent gel with a faint light-yellow tint; does not obstruct the technician’s view under a microscope. Viscosity Stability Formulated to resist thinning at room temperature while reacting ideally under soldering heat. 4. Chemical & Safety Profile Composition Basis Halogen-free, Lead-free, and Acid-free formulation to prevent long-term trace corrosion. Environmental & Health Impact Low-smoke, low-odor emission profile; non-toxic during standard thermal operations. Corrosivity Level Non-corrosive to copper traces, IC pins, and multi-layer PCB boards. 5. Solder Performance & Mechanics Wetting Action Drastically reduces molten solder surface tension, enabling rapid tin climbing and flawless pad coating. Oxidation Management Instantly dissolves microscopic metal surface oxides and forms a protective thermal blanket against re-oxidation. Thermal Tolerance Withstands standard hot air station and soldering iron temperatures without charring prematurely. 6. Electrical & Insulation Traits Conductivity Behavior Non-conductive post-soldering residue; maintains high surface insulation resistance (SIR). Signal Integrity Prevents electrical leakage or short circuits in high-frequency mobile and computer circuits. 7. Residue & Cleaning Behavior No-Clean Technology Leaves minimal, inert, non-tacky microscopic residue post-heating. Cleaning Requirement Optional for general repairs; easily and cleanly removable using standard Isopropyl Alcohol (IPA) if required. 8. Storage & Handling Guidelines Shelf Life & Storage Stable under room temperature (10°C to 25°C); store away from direct sunlight in an upright position. Cap Management Requires immediate cap sealing post-use to prevent the gel matrix from drying out inside the syringe. JTX JS-51 Soldering Flux: Comprehensive 1000-Word Specification Table Section / Category Feature / Parameter In-Depth Technical Specification & Practical Explanation 1. Product Introduction & Overview Brand & Model Identification JTX JS-51 is a globally recognized professional-grade soldering flux manufactured by JiTongXue, specifically formulated for advanced electronics technicians, micro-soldering experts, and mobile repair engineers dealing with complex motherboard layouts. Primary Use Cases Engineered for smartphone motherboard repair (iPhone/Android), BGA chip reballing, CPU/IC replacement, jumper wire routing, and precision surface-mount technology (SMT) or through-hole component assembly. Target Audience Mobile repair technicians, computer hardware specialists, drone builders, custom keyboard enthusiasts, and advanced electronics hobbyists requiring extreme precision. 2. Packaging & Delivery System Syringe Container Design Supplied in an ergonomic, air-tight syringe tube that prevents contamination, dust accumulation, and premature chemical drying, ensuring fresh flux output every time. Dispensing & Accuracy Fully compatible with fine-gauge blunt-tip dispensing needles, allowing technicians to apply microscopic dots of flux directly onto tiny solder pads without flooding adjacent components. Volume & Ergonomics Optimized weight and volume ratio for handheld comfort during long hours of microscope work, reducing hand fatigue and eliminating material waste. 3. Physical & Optical Characteristics Gel Matrix Consistency Features a semi-viscous, smooth, jelly-like consistency. Unlike watery fluxes that easily spill or run across the PCB when heated, JS-51 stays precisely where it is dispensed. Visual Transparency Formulated as a transparent gel with a subtle light-yellow tint. This high optical clarity ensures that technicians can clearly monitor the solder melting and joint formation process under a microscope. Thermal Viscosity Balance Designed to hold its position at room temperature while instantly thinning out and flowing smoothly the moment heat from a soldering iron or hot air station is applied. 4. Chemical Composition & Safety Eco-Friendly Formulation Completely halogen-free, lead-free, and acid-free, complying with modern environmental safety standards and preventing long-term chemical degradation of circuit boards. Smoke & Odor Profile Incorporates advanced organic activators that produce significantly lower smoke emissions and a mild, non-offensive odor profile, protecting the technician’s eyes and respiratory system. Corrosion Resistance Completely non-corrosive to copper traces, delicate IC pins, and multi-layer printed circuit boards, eliminating the risk of green corrosion over time. 5. Solder Performance & Mechanics Wetting & Flow Enhancement Drastically lowers the surface tension of molten solder, enabling rapid tin climbing, smooth spreading, and the creation of strong, shiny, and reliable solder joints. Oxidation Management Chemically strips away microscopic metal oxide layers from copper pads and component legs instantly upon heating, while forming a protective blanket to prevent re-oxidation. Thermal Stability Withstands high operating temperatures required for lead-free soldering processes without charring, burning prematurely, or leaving behind stubborn carbonized deposits. 6. Electrical & Insulation Properties Surface Insulation Resistance (SIR) Maintains exceptionally high insulation resistance post-heating, ensuring that residual compounds do not cause electrical leakage or cross-talk between high-frequency traces. Signal Integrity Protection Safe for sensitive digital logic boards, RF shields, and high-speed data lines, preserving signal clarity and preventing erratic device behavior or intermittent faults. 7. Residue Behavior & Cleaning Advanced No-Clean Technology Leaves behind a minimal, inert, non-tacky microscopic residue after the soldering cycle is complete, meaning standard consumer devices rarely require mandatory scrubbing. Post-Cleanup Process For high-reliability military, medical, or premium device repairs where absolute cleanliness is required, any residual trace can be effortlessly dissolved using standard Isopropyl Alcohol (IPA) and an ESD brush without leaving white films. 8. Storage, Shelf Life & Best Practices Storage Guidelines Store in an upright position in a cool, dry environment away from direct sunlight and excessive heat, ideally maintaining ambient storage temperatures between 10°C to 25°C. Cap Management Rule The protective cap must be tightly sealed immediately after each use to prevent ambient air exposure from hardening the inner gel matrix. Application Best Practice Apply sparingly; a microscopic amount is sufficient for optimal results. Over-application can cause components to float or shift alignment during the reflow process. More Products : https://gsmtoolsindia.com/ Follow us on https://www.instagram.com/gsmtoolsindia_official?igsh=amtzcjZueHBxNDZl&utm_source=qr