Ударопрочный заливочный компаунд СТЭП-К337 (отн. удлинение 20-30%)

Step-K337 is an epoxide potting compound that cures at room temperature and has moderate elasticity. It is used for sealing microchips, coils, electrical connectors, and other electronic components to protect against external factors.

• The description claims the compound has moderate elasticity (relative elongation of 15-25%).
• The description claims it resists impact, vibration, and temperature changes.
• The description claims it does not emit volatile substances during curing.
• The description claims it has a low exothermic effect.
• The description claims it has high adhesion to materials used in radio-electronic technology.