PL-LGA3647-2US CPU Cooler for 2U Chassis

The ProLab Design PL-LGA3647-2US is a compact high-performance 2U Server CPU Cooler designed specifically for Intel LGA3647 square motherboard platforms, making it ideal for enterprise servers, cloud infrastructure, virtualization systems, edge computing deployments, and high-density rackmount environments. Engineered for efficient thermal performance within compact server chassis, the cooler is optimized for Intel Xeon Scalable processors operating under continuous enterprise workloads. Built using a copper base, aluminum fin heatsink assembly, and 4 high-efficiency copper heat pipes, the PL-LGA3647-2U-S is engineered to provide rapid heat transfer and stable thermal dissipation for enterprise-grade processors. Supporting CPUs with power requirements up to 205W, the cooler delivers dependable thermal management for demanding server applications while maintaining compatibility with space-constrained rackmount systems. The industrial-grade PWM cooling fan operates between 2100 and 6800 RPM, delivering up to 34.50 CFM airflow for focused heat dissipation across dense heatsink fin arrays. Equipped with durable double ball bearings and a 4-pin PWM connector, the fan dynamically adjusts cooling performance based on processor thermal load while ensuring long-term operational reliability in 24/7 server environments. The cooling system is optimized for compact chassis airflow management while maintaining a maximum acoustic output of 52 dBA. With compact dimensions of 91mm x 88mm x 64.5mm, the PL-LGA3647-2U-S is purpose-built for 2U and compact rackmount server chassis compatibility. The reinforced mounting design ensures secure installation and efficient contact pressure distribution across Intel LGA3647 processors for stable long-term operation. Combining enterprise-grade thermal engineering, compact airflow optimization, and support for Intel Xeon server platforms, the ProLab Design PL-LGA3647-2U-S is an ideal cooling solution for virtualization hosts, enterprise compute nodes, storage servers, cloud platforms, rendering systems, and high-density server deployments requiring efficient cooling performance in space-constrained environments.