CO2多相流乾法清洗機

CO2多相流乾法清洗機

SKU: SGS-SA300
In stock View at Merchant

This product is designed for cleaning Wafer, chips, Sensor, optical lenses, prisms, PCBA, FPC, and光纤. It can remove particles as small as 0.1um and has a cleaning yield of 99%.

  • The description claims a minimum particle removal size of 0.1um and a cleaning yield of 99%.

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Data sourced from www.fortunetell.com.tw. Last updated: The description was auto-generated by an AI model based on the merchant's description. It may not be accurate or complete.
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Takes ~2 minutes. No storefront changes.