THERM-A-GAP CIP 60 Thermally Conductive Cure-In-Place Compound

THERM-A-GAP CIP 60 Thermally Conductive Cure-In-Place Compound

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JIT Asia THERM-A-GAP CIP 60 is a two-component thermal gap filler designed for electronic and automotive applications, offering improved heat dissipation and thermal conductivity of 6.0 W/m-K.

  • The description claims improved application flexibility and reliability.

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