Bambu Lab Nozzle Wiping Pad [H2D/H2C]
Overview The Nozzle Wiping Pad is installed on the nozzle wiper part of the purge wiper and is used to remove residual waste on the nozzle. It is made of soft silicone material to ensure good contact with the hotend during wiping. Usage Tips The Nozzle Wiping Pad is used to clean the nozzle before initiating a print job. Upon each print start, the cleaning process will automatically execute without manual intervention. Replacing the silicone wiping component is part of routine maintenance. If the pad shows signs of aging, cracking, or damage, it should be replaced immediately to ensure optimal performance. Installation For H2D/H2C: Bambu Lab Wiki. In the Box - Nozzle Wiping Pad*5 Compatibility H2D and H2D Laser H2C and H2C Laser Product Specifications Materials Plastic Packaging Size 60*60*30 mm Color Black Packaging Weight 0.007 kg
Variants (1)
- Default Title — 10.99 CAD — Out of stock
AI Readiness
Good foundation, but some important product data is still missing.