Power Adhesives Overtec 5 FR Low Pressure Moulding Hot Melt 12/15 mm, UL 94 V0

Power Adhesives Overtec 5 FR low pressure moulding hot melt is a thermoplastic moulding material designed for encapsulating, sealing and protecting components. The low pressure moulding process uses a low injection pressure, allowing delicate or fragile components to be encapsulated and protected. Overtec 5 FR provides an alternative process positioned between conventional potting and injection moulding. The material is supplied in 12/15 mm format and operates at an application temperature of 160–195°C. The adhesive is loaded into a suitable hot melt applicator and heated to its operating temperature before use. The material provides good chemical and water resistance together with strong electrical insulation properties, including high electrical resistance and dielectric strength. Heat resistance reaches 135°C, while the material retains flexibility down to –35°C. Its softening point is 85°C. Overtec 5 FR also provides flame-retardant properties and meets the UL 94 V0 classification. These characteristics make it suitable for encapsulation applications where electrical insulation, environmental protection and flame resistance are required. Compared with conventional two-component potting compounds, low pressure moulding can provide shorter production cycles and a simpler, cleaner process. It also requires significantly lower investment than conventional injection moulding. Technical Specifications Brand: Power Adhesives Product: Overtec 5 FR Product type: thermoplastic low pressure moulding material Format: 12/15 mm Setting time: medium Application temperature: 160–195°C Softening point: 85°C Heat resistance: up to 135°C Low-temperature flexibility: down to –35°C Flammability classification: UL 94 V0 Properties: chemical resistance - water resistance - electrical resistance - dielectric strength Process: low pressure moulding Application: encapsulation - sealing - component protection Key Features Thermoplastic low pressure moulding hot melt Suitable for encapsulating delicate and fragile components UL 94 V0 flammability classification Heat resistance up to 135°C Remains flexible down to –35°C Good chemical and water resistance High electrical resistance and dielectric strength 160–195°C application temperature 12/15 mm format Medium setting time Applications & Usage Overtec 5 FR low pressure moulding material is designed to encapsulate components for sealing and protection. The low injection pressure makes the process suitable for delicate components that may not be appropriate for conventional high-pressure injection moulding. The material is suitable for applications requiring protection against water, chemicals and temperature changes together with electrical insulation. Its electrical resistance and dielectric strength make it particularly relevant for encapsulating electrical and electronic components where the material's specified properties meet the application requirements. Overtec 5 FR sticks are loaded into a suitable applicator, heated to an operating temperature of 160–195°C, and applied around the component as part of the low pressure moulding process. Advantages Low injection pressure is suitable for encapsulating delicate components Bridges the gap between potting and conventional injection moulding Shorter cycle times than many conventional potting processes Simple and clean processing Good chemical and water resistance Suitable for electrical insulation applications Heat resistance up to 135°C Retains flexibility down to –35°C UL 94 V0 classification supports flame-retardant applications Lower investment requirements than conventional injection moulding Applications / Industries Electrical component encapsulation Electronic component encapsulation Component sealing Electrical insulation Moisture and water protection Industrial component protection Low pressure moulding of delicate components Electronics manufacturing Electrical equipment manufacturing Industrial assembly and production