RedHawk-SC Electrothermal 2026 R1 for Linux

Synopsys RedHawk-SC Electrothermal – Multiphysics Signoff Software for 2.5D/3DIC Designs Synopsys RedHawk-SC Electrothermal is the industry-leading multiphysics simulation platform for power integrity, thermal integrity, signal integrity, and structural analysis of advanced 2.5D/3DIC multi-die systems. Built on golden solvers and hierarchical reduced-order models, it delivers foundry-certified electrothermal co-simulation from early prototyping through final signoff. Analyze chip-package-system interactions, predict hotspots, EM risks, warpage, and thermal stress with high accuracy and scalability for the most complex semiconductor designs. Ideal for SoC, package, and system designers seeking reliable multiphysics integrity in next-generation multi-die architectures.