T-7000 : High Precision Die Bonder for Nano & Opto Electronics

T-7000 : High Precision Die Bonder for Nano & Opto Electronics

0.00 EUR In stock Buy at Merchant

The TRESKY T-7000 is a die bonding system for micro-assembly in photonics, nanoelectronics, and MEMS applications, featuring a modular design.

  • The TRESKY T-7000 is designed for advanced micro-assembly in photonics, nanoelectronics, and MEMS applications.
Data sourced from accelonix.nl. Last updated: The description was auto-generated by an AI model based on the merchant's description. It may not be accurate or complete.
Own this store? Claim it here →