IPC-HDBK-850 - Handbook: Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly- Download

IPC-HDBK-850 - Handbook: Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly- Download

Brand: IPC
SKU: 850-HB-0-D-0-EN-0
139.00 USD In stock Buy at Merchant

A 68-page handbook released in 2012 to help designers and users understand potting and encapsulation materials and their application in electronic circuit board assembly.

  • The description claims that the document uses specific terminology related to electronic printed circuit board assembly and protection.
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  • Regular Price — 198.00 USD — In stock
  • IPC Member Price — 139.00 USD — In stock

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