AMTECH NC-559-V3 TF

DOWNLOADS Technical Data Sheet Safety Data Sheet PRODUCT INFO AMTECH NC-559-V3 is the 3rd generation of the famous NC-559 tacky flux. Developed to achieve even better wetting and a clearer transparent residue, it is formulated for syringe application, stencil printing and rework processes on all PCB surface finishes. AMTECH NC-559-V3 performs excellent for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites. ROL0 flux classification Wide process window Excellent wetting compatibility on most board finishes Clear residue High temperature compatible Compatible Alloys Alloy Temp °C Temp °F 63Sn/37Pb 183 361 62Sn/36Pb/2Ag 179 354 62.8Sn/36.8Pb/0.4Ag 179-183 354-361 60Sn/40Pb 183-191 361-376 43Sn/43Pb/14Bi 144-163 291-325 42Sn/58Bi 138 280 10Sn/88Pb/2Ag 268-290 514-554 Test Results Test J-STD-004 or other requirements (as stated) Test Requirement Result Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6.15 L: No corrosion Quantitative Halides IPC-TM-650: 2.3.28.1 L: No halogen Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (no-clean) Viscosity - Brookfield/20 °C Mobile F HELIPATH system, at 5 rpm IPC-TM-650: 2.4.34.4 Typical 400 Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Coalition (EICC) Compliant REACH Compliance Articles 33 and 67 of Regulation (EC) No 1907/2006 May contain up to 7% w/w of ethoxylated 4-nonylphenol Process Recommendation The best process will depend on factors such as operating conditions, equipment, board or component design. Our team is ready to advise you. Reflow Guideline This profile is designed to serve as a starting point for process optimization using NC-559-V3. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone, (140-180 °C) for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds. Cleaning Post Soldering AMTECH NC-559-V3 is a no-clean tacky flux, so cleaning is not required to meet IPC standards. The chemistry is specially designed so that any remaining flux residue is chemically inert and will not impact your assembled board or packaging under normal conditions. However, when cleaning is desired or required (e.g. high reliability assembly or to improved conformal coating adhesion), the flux residue can be easily removed with Inventec’s own formulated flux cleaners. Process Type PCBA Defluxing Solutions Manual QuicksolvTM DEF 90, QuicksolvTM DEF 70 (aerosol) Aqueous system (Immersion or spray) PromocleanTM DISPER 607, PromocleanTM DISPER 707, PromocleanTM DISPER 800 Co-solvent system TopkleanTM EL 20P or EL 20A + HFE bases solvents Mono-solvent (Azeotropic) PromosolvTM 70ES Other products are available, depending on specific customer requirements. Also check our maintenance cleaning solutions. Health, Safety & Environment No issues when used as recommended. In accordance with the Annex II of Directive 2011/65/UE (RoHS), including its amendments, we certify that this product does not contain quantities above 0.1% of Hg, Pb, Cr VI, PBB, PBDE, DEHP, BBP, DBP, DIBP and above 0.01% of Cd. Inventec Performance Chemicals also fulfills its direct obligations under the REACH and Conflict Mineral regulations. TAGS