Lanrui Heat Shield Plate High Temperature Protection for PCB Soldering IC

Lanrui heat shield plate for board-level rework - a high-temperature resistant glass mat used during CPU and IC chip soldering on phone main boards. Sits over the area you are NOT reworking, so the heat from the hot air gun or soldering iron is held off adjacent components. The same plate is used as an explosion-proof solder gasket during BGA reballing - the ultra-white glass surface stops solder balls from bursting or spreading during reflow, and gives a flat reference surface for tin plating mobile phone CPU chips. Useful for technicians who want a steadier, cleaner reball than working on the bare board. Features: High Temperature Resistant: Ultra-white glass material stands up to the heat from hot air rework and chip-level reflow without deforming. Protects Adjacent Components: Acts as a thermal shield over neighbouring ICs while you rework the target chip. Explosion-Proof Reballing Surface: Prevents solder balls from bursting or rolling off during BGA reballing - flat, stable surface for tin plating. Impact Resistant: Stable and durable enough to sit on the bench job after job. Cost-Effective Bench Accessory: A small consumable that helps avoid costly collateral damage to surrounding components during rework. Specifications: Brand: Lanrui Material: high-temperature resistant ultra-white glass Use: PCB heat shielding, BGA reballing, IC tin plating Compatibility: phone main board / motherboard rework Compatibility: Universal phone repair bench accessory - works alongside any hot air rework station, soldering iron and BGA reballing kit. Package Contents: 1 x Lanrui Heat Shield Plate