RL-422S-IM BGA Flux Paste is a high-performance solder flux designed for ball grid array (BGA) assembly and rework applications. This paste delivers excellent wetting and spreading characteristics, ensuring reliable solder joints on fine-pitch components. Formulated with advanced chemistry, it provides superior flux activity during reflow soldering while maintaining low residue levels for cleaner PCB surfaces. The paste offers extended working time, making it ideal for both manual and automated assembly processes. Key benefits include improved solder flow, reduced bridging and tombstoning, and enhanced thermal stability. Compatible with lead-free and lead-based solder systems, RL-422S-IM is engineered to meet stringent electronics manufacturing standards. Perfect for high-reliability applications in telecommunications, automotive, and industrial electronics where consistent, defect-free solder joints are critical.