RAK3172-F Module for LoRaWAN® with External Flash | Ultra-low-power module for LoRaWAN with extra flash and rollback recovery | RAK3172-F

What is the RAK3172-F Module for LoRaWAN with External Flash? The RAK3172-F Module for LoRaWAN with external flash is a low-power module for LoRaWAN that ensures safer rollback-based firmware updates. It combines LoRa® radio functionality and MCU processing in a single module while preserving the same footprint and pinout as the earlier RAK3172 design. A key difference is the added external flash, which allows FUOTA-ready architectures and dual-image rollback strategies for safer remote firmware management. This reduces maintenance effort for devices deployed across difficult-to-access locations. Quick Technical Overview Item Details MCU STM32WLE5JC (ARM Cortex-M4) LoRaWAN v1.0.4 Class A/B/C Communication Modes LoRaWAN and LoRa P2P External Flash 512 KB Sleep Current Typical 2.2 µA Interfaces UART, SPI, I2C, GPIO, ADC Development Options AT Commands, RUI3 API Activation Methods OTAA / ABP Why Use FUOTA-Ready LoRaWAN Hardware? RAK3172-F reduces the risk of failed OTA updates by using external flash memory to store and validate new firmware before activation. Standard OTA updates often replace firmware directly during installation. If an update fails due to weak signals, unstable power, or interrupted connections, remote devices may stop working and require physical maintenance. RAK3172 vs RAK3172-F: What Changed? Feature RAK3172 RAK3172-F External Flash No Yes FUOTA Ready Basic Improved Rollback Firmware Strategy Limited Supported PCB Compatibility — Pin-compatible Migration Effort — Minimal Remote Update Reliability Moderate Improved Long-Term Maintenance Focus Moderate Strong LoRaWAN vs LoRa P2P: Which Should You Use? LoRaWAN is best for managed cloud-connected networks, while LoRa P2P is better for direct device-to-device communication. RAK3172-F supports both LoRaWAN and LoRa P2P communication, giving developers flexibility to build either cloud-connected IoT systems or private long-range wireless networks using the same hardware platform. Key Features Feature Description Pin-compatible RAK3172 upgrade path Reuse existing RAK3172 PCB layouts with minimal redesign effort. Extra external flash for FUOTA Supports safer remote firmware updates and rollback-oriented recovery workflows. Ultra-low-power operation Designed for long-life battery-powered IoT deployments and remote field devices. Integrated LoRa radio + MCU Combines wireless communication and processing in a compact embedded architecture. LoRaWAN Class A/B/C support Supports standard LoRaWAN operation with OTAA and ABP activation methods. LoRa P2P communication Enables direct device-to-device wireless communication without LoRaWAN infrastructure. Compatible with major LoRaWAN servers Works with TTN, ChirpStack, Actility, and private LoRaWAN deployments. AT command interface Simplifies evaluation, integration, and rapid prototyping workflows. Arduino development support via RUI3 Supports custom firmware development using Arduino-compatible APIs. Suitable for remote IoT deployments Designed for industrial telemetry, environmental monitoring, smart agriculture, and asset tracking systems. Deployment Considerations for Battery-Powered IoT Devices Battery life depends on communication frequency, device class selection, and firmware update behavior, not only sleep current. Among the LoRaWAN device classes, Class A is typically the most energy-efficient. Devices remain in a low-power sleep state for the majority of the time, only briefly opening two short receive windows immediately after transmitting an uplink. Compatible LoRaWAN Ecosystems and Servers RAK3172-F works with public and private LoRaWAN networks, including: The Things Network (TTN) ChirpStack Actility Private LoRaWAN servers Custom LoRaWAN infrastructures This allows developers to move from prototyping to production without changing hardware. Typical Development Workflow This workflow helps simplify migration from prototyping toward long-term deployment validation. Configure the module using AT commands or RUI3 APIs Validate LoRaWAN joins through TTN or private servers Test payload transmission and power behavior Configure FUOTA and rollback handling strategies Validate RF performance and deployment stability Deploy firmware updates remotely during field operation RF Deployment and Antenna Considerations Communication reliability depends on antenna selection, enclosure design, gateway placement, and local RF conditions. Proper antenna matching and network planning help improve packet delivery while reducing unnecessary retransmissions and power consumption. Engineering Validation The following examples illustrate deployment behaviors observed during evaluation and field testing. Validation Area Result Sleep Current Typical sleep current of 2.2 µA for low-power operation FUOTA Recovery Testing 3 rollback recovery trials completed successfully during firmware update validation Packet Delivery Validation Delivery success improved from 82% to 97% during field telemetry testing Firmware Maintenance Service visits reduced by 41% after remote update deployment Deployment Scale Tested 120 installed telemetry nodes validated during field evaluation Use Case Examples for RAK3172-F Module for LoRaWAN with External Flash Use Case #1: Remote Irrigation Monitoring Upgrade A smart agriculture integrator replaced aging nodes experiencing 18% maintenance-related downtime. After migrating to RAK3172-F, field testing across 60 sensor nodes reduced service visits by 41%. Three firmware rollback trials completed successfully. Updates became predictable without pulling devices from the field. Use Case #2: Industrial Tank Telemetry Retrofit During a refinery modernization project, operators using an industrial telemetry module for LoRaWAN observed inconsistent reporting from legacy hardware, averaging 82% successful packet delivery. Engineers introduced RAK3172-F-based LoRaWAN nodes and validated performance through two weeks of packet logging and communication reliability testing. Delivery reliability increased to 97%, while deployment yield stayed consistent across 120 installed units. Configuration and replacement workflows became easier to standardize. Comparison: RAK3172-F vs Common LoRaWAN and LoRa Development Modules Feature RAK3172-F Module for LoRaWAN with External Flash (This product) Seeed Studio LoRa-E5 Heltec ESP32 LoRa Boards LILYGO T3 / LoRa Devices Dragino LoRaWAN Modules Main Architecture STM32WLE5JC integrated LoRa MCU STM32WLE5JC integrated LoRa MCU ESP32 + LoRa transceiver ESP32 + LoRa transceiver LoRaWAN-focused industrial nodes External Flash for Firmware Staging Yes (512 KB) No No No Varies by model Rollback Firmware Strategy Supported Not documented User-implemented User-implemented Limited Pin-Compatible Upgrade Path Yes (RAK3172 migration) No No No No LoRaWAN Support Yes Yes Yes Yes Yes LoRa P2P Support Yes Yes Yes Yes Varies Remote Deployment Focus Strong Moderate Low Low Strong Industrial Telemetry Positioning Strong Moderate Limited Limited Strong Ultra-Low-Power Optimization Strong Strong Moderate Moderate Strong AT Command Workflow Yes Yes Varies Varies Yes Arduino Development Support Yes (RUI3) Yes Yes Yes Partial Deployment Lifecycle Focus Strong Moderate Low Low Moderate Target Users Industrial IoT developers and OEMs Embedded developers Makers and hobbyists DIY and experimental users Industrial LoRaWAN integrators Primary Focus Industrial deployment General LoRaWAN development Development board DIY experimentation Industrial telemetry systems What’s in the Box 1 pc WisDuo Module RAK3172-F How to Get Started with RAK3172-F Module for LoRaWAN with External Flash Overview of RAK3172 WisDuo LoRaWAN Module Quick Start Guide of RAK3172 WisDuo LoRaWAN Module Datasheet of RAK3172 WisDuo LoRaWAN Module AT Command Manual of RAK3172 WisDuo LoRaWAN Module Low-Level Development Reference of RAK3172 WisDuo LoRaWAN Module Overview of RAKwireless Unified Interface V3 (RUI3) RUI3 Best Practices RUI3 Tips and Tricks