Sawatec Spin Module SM-200

FEATURES (BASIC CONFIGURATION) Up to 50 programmes with 24 segments each can be programmed Quick start/stop function for repeat processes User-friendly process configuration with touchscreen Process parameters: spin speed, segment time, dosing functions Rotational direction can be selected (CW, CCW) Dynamic dosing arm for up to 4 media lines Manual loading and unloading of the substrates Substrate fixation via vacuum incl. vacuum guard Acoustic signal after the end of the process ADDITIONAL FUNCTIONS (OPTIONS) Additional dosing lines Automatic cartridge dosing system, 50 ml glass cartridge Top side edge bead removal (EBR circular and linear) Backside rinse of substrates to remove any backside edge contamination Automatic needle cleaning Program controlled Filter Fan Unit (FFU) Bowl protection insert for easy and efficient cleaning Wafer alignment tool 1 – 12″ (round) PERFORMANCE DATA Speed range: 1 to 6’000 rpm +/-1 rpm Difference from set rotation speed to actual value < +/-1 % Speed acceleration: 0 – 6’000 rpm in min. 1 sec. (chuck size ≤ 150 mm) Process time up to 7’200 seconds with 0,1 sec. steps Time controlled dosage