EC360® NON SILICONE Thermal Pad
The EC360® NON SILICONE series offers silicone-free thermal conductive gap fillers suitable for various electronic applications, including hard disks, optical communication, and automotive control equipment.
- The EC360® NON SILICONE series has a high thermal conductivity of 5.0 W/mK.
- These gap fillers are easy to assemble and provide reliable thermal management solutions.
Specifications
- Size
- 100 x 100 x 0.5 mm, 100 x 100 x 1.0 mm, 100 x 100 x 1.5 mm, 100 x 100 x 2.0 mm, 100 x 100 x 2.5 mm, 100 x 100 x 3.0 mm, 100 x 100 x 4.0 mm, 100 x 100 x 5.0 mm
Variants (8)
- 100 x 100 x 0.5 mm — 4.19 EUR — In stock
- 100 x 100 x 1.0 mm — 5.03 EUR — In stock
- 100 x 100 x 1.5 mm — 5.87 EUR — In stock
- 100 x 100 x 2.0 mm — 6.71 EUR — In stock
- 100 x 100 x 2.5 mm — 7.55 EUR — In stock
- 100 x 100 x 3.0 mm — 8.39 EUR — In stock
- 100 x 100 x 4.0 mm — 9.24 EUR — In stock
- 100 x 100 x 5.0 mm — 10.08 EUR — In stock
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