PostProcess DEMI 430

Industrial support and resin removal For SLA, CLIP and DLP technologies, the PostProcess™ DEMI 430 Support & Resin Removal Submersion Device enables automatic removal of PolyJet and FDM supports and excess resin. PostProcess Technologies' Submersed Vortex Cavitation (SVC) technology is already integrated in the DEMI 430 version to ensure a uniform cleaning effect. The DEMI 430 provides a precise, automated post-process solution for additive manufacturing operations. A uniquely,e software-controlled process control in conjunction with special cleaning agents, ensures highly efficient cleaning of components. Technical data: Basin size: 355 x 355 x 355 mm. Capacity for consumables: 64 liters Variable temperature: 30-63°C